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Micro-diffusion bonding equipment - List of Manufacturers, Suppliers, Companies and Products

Micro-diffusion bonding equipment Product List

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Micro-diffusion bonding device

Micro-diffusion bonding device

Micro-diffusion bonding device

【Specifications】 Pressurization method: Weight method using weights and leverage Overheating dimensions: 40 diameter x 40 height Overheating method: High frequency, programmable temperature control Maximum overheating temperature: 1400℃ Vacuum level: x10-5 PA High frequency power supply: 20KW

  • Mixer/agitator
  • Granulating Equipment

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